研究著作
Publications
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期刊論文 (Journal Papers):
1. Tung, Y.-C., Wang, C.-K., Huang, Y.-K., Huang, C.-K., Peng, C.-C., Patra, B., Chen, H.-K., Tsao, P.-N. & Ling, T.-Y. “Measurement of Oxygen Diffusivity through Cell Layers using Bio-mimetic Microfluidic Device.” submitted.
2. Wang, C.-K.* & Ko, P.-L. “Robust Topology Optimization of Solid Continua for Peak Response Serviceability to Uncertain Quasi-Static Loads with Temporal Correlation.” Struct. Multidisc. Optim., 2019, 60(2): 443–460. (*Corresponding author; IF: 4.105; Rank: 11/134 in Mechanics)
3.Wang, C.-K.*, Tsai, C.-M., Chuang, B.-S. & Lo, Y.-L. “Structural Optimization with Design Constraints on Peak Responses to Temporally Correlated Quasi-Static Load Processes.” Struct. Multidisc. Optim., 2019, 59(2): 521–538. (*Corresponding author; IF: 4.105; Rank: 11/134 in Mechanics)
4. Wang, C.-K.*, Liao, W.-H., Wu, H.-M. & Tung, Y.-C. “One-Step Approach to Fabricating Polydimethylsiloxane Microfluidic Channels of Different Geometric Sections by Sequential Wet Etching Processes.” J. Vis. Exp., 2018, 139: e57868 (10 pages). (Invited paper; *Corresponding author; IF: 1.682; Rank: 30/64 in Multidisciplinary Sciences)
5. Wang, C.-K.*, Liao, W.-H., Wu, H.-M., Lo, Y.-H., Lin, T.-R. & Tung, Y.-C.* “Single Step Sequential Polydimethylsiloxane Wet Etching to Fabricate a Microfluidic Channel with Various Cross Sectional Geometries.” J. Micromech. Microeng., 2017, 27(11): 115003 (9 pages). (*Corresponding author; IF: 2.157; Rank: 27/59 in Instruments and Instrumentation)
6. Jang, B., Kim, J.-H., Lee, H.-J., Kim, K.-S. & Wang, C.-K. “System and Method for Measuring Distribution of Deformation using Atomic Force.” Korea Patent, Registration No. 10-1633648: issued on June 21, 2016.
7. Lin, C.-H.†, Wang, C.-K.†, Chen, Y.-A., Peng, C.-C., Liao, W.-H. & Tung, Y.-C.* “Measurement of In-Plane Elasticity of Live Cell Layers Using a Pressure Sensor Embedded Microfluidic Device.” Scientific Reports, 2016, 6: 36425 (14 pages). (†First Authorship; IF: 4.525; Rank: 13/64 in Multidisciplinary Sciences)
8. Jang, B., Kim, J.-H., Lee, H.-J., Kim, K.-S. & Wang, C.-K. “Device and Method for Measuring Distribution of Atomic Resolution Deformation.” United States Patent Application Publication, Pub. No. US 2015/0121575 A1, Pub. Date: April 30, 2015.
9. Jang, B., Kim, J.-H., Lee, H.-J., Kim, K.-S. & Wang, C.-K. “Device and Method for Measuring Distribution of Atomic Resolution Deformation.” United States Patent, Patent No. 9,003,561 B1: filed on April 10, 2014, and issued on April 7, 2015.
10. Kim, K.-S.*, Wang, C.-K., Cha, M.-H. & Chew, H. B. “Continuum Description of Atomistics for Nanomechanics of Grain Boundary Embrittlement in FCC Metals.” Bull. Am. Phys. Soc., 2012, 57(1).
11. Wang, C.-K., Chew, H. B. & Kim, K.-S.* “Nanometer Scale Mechanical Behavior of Grain Boundaries.” Mater. Res. Soc. Symp. Proc., 2011, 1297: 1-9.
12. Chen, C.-S.*, Wang, C.-K. & Chang, S.-W. “Atomistic Simulation and Investigation of Nanoindentation, Contact Pressure and Nanohardness.” Int. J. Interact. Multiscale Mech., 2008, 1(4): 411-422. |